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1

[IEEE 2012 IEEE 30th VLSI Test Symposium (VTS) - Maui, HI, USA (2012.04.23-2012.04.25)] 2012 IEEE 30th VLSI Test Symposium (VTS) - Direct connection and testing of TSV and microbump devices using NanoPierce™ contactor for 3D-IC integration

Yaglioglu, Onnik, Eldridge, Ben

Year:

2012

Language:

english

File:

PDF, 4.78 MB

english, 2012

2

High-Performance HBM Known-Good-Stack Testing

Loranger, Marc, Yaglioglu, Onnik, Oonk, John

Journal:

IEEE Design and Test

Year:

2017

Language:

english

File:

PDF, 2.84 MB

english, 2017

3

Wide Range Control of Microstructure and Mechanical Properties of Carbon Nanotube Forests: A Comparison Between Fixed and Floating Catalyst CVD Techniques

Onnik Yaglioglu, Anyuan Cao, A. John Hart, Rod Martens, A. H. Slocum

Journal:

Advanced Functional Materials

Year:

2012

Language:

english

File:

PDF, 4.48 MB

english, 2012

4

[IEEE 2011 IEEE 57th Holm Conference on Electrical Contacts (Holm 2011) - Minneapolis, MN, USA (2011.09.11-2011.09.14)] 2011 IEEE 57th Holm Conference on Electrical Contacts (Holm) - Compliant Carbon Nanotube-Metal Contact Structures

Yaglioglu, Onnik, Martens, Rod, Cao, Anyuan, Slocum, A. H.

Year:

2011

Language:

english

File:

PDF, 6.41 MB

english, 2011

5

[IEEE 2014 IEEE 60th Holm Conference on Electrical Contacts (Holm) - New Orleans, LA, USA (2014.10.12-2014.10.15)] 2014 IEEE 60th Holm Conference on Electrical Contacts (Holm) - Electroless silver plating and in-situ SEM characterization of CNT-metal hybrid contactors

Yaglioglu, Onnik, Fang, Treliant, Martens, Rod, Eldridge, Ben

Year:

2014

Language:

english

File:

PDF, 1.31 MB

english, 2014

6

Method of characterizing electrical contact properties of carbon nanotube coated surfaces

Yaglioglu, Onnik, John Hart, A., Martens, Rod, Slocum, Alexander H.

Journal:

Review of Scientific Instruments

Year:

2006

Language:

english

File:

PDF, 162 KB

english, 2006

7

[IEEE 2013 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2013.10.2-2013.10.4)] 2013 IEEE International 3D Systems Integration Conference (3DIC) - Contact testing of copper micro-pillars with very low damage for 3D IC assembly

Yaglioglu, Onnik, Eldridge, Ben

Year:

2013

File:

PDF, 614 KB

2013

8

[IEEE 2013 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2013.10.2-2013.10.4)] 2013 IEEE International 3D Systems Integration Conference (3DIC) - Contact testing of copper micro-pillars with very low damage for 3D IC assembly

Yaglioglu, Onnik, Eldridge, Ben

Year:

2013

Language:

english

File:

PDF, 614 KB

english, 2013

9

SPIE Proceedings [SPIE SPIE's 8th Annual International Symposium on Smart Structures and Materials - Newport Beach, CA (Sunday 4 March 2001)] Smart Structures and Materials 2001: Smart Structures and Integrated Systems - Modeling, design, and simulation of a piezoelectrically driven microvalve for high-pressure high-frequency applications

Roberts, David C., Yaglioglu, Onnik, Carretero, Jorge A., Su, Yu-Hsuan, Saggere, Laxminarayana, Hagood, Nesbitt W., Davis, L. Porter

Year:

2001

Language:

english

File:

PDF, 409 KB

english, 2001